07
Sep
— Cooperation on LPU and AI Memory chips for data centers targets next-generation AI servers and hyperscale data centers
【7 September 2026, Penang, Malaysia】 – Xinpal (Malaysia) Sdn. Bhd. ("XinPal Malaysia"), the Malaysian entity of XinPal, and Linkwing AI Technology (Malaysia) Sdn. Bhd. ("Linkwing AI Technology Malaysia"), the Malaysian AI-focused subsidiary of Taiwan-based Linkwing Technology, have officially entered into a Strategic Memorandum of Understanding ("MOU"). Under the MOU, the two parties will cooperate on LPU (Language Processing Unit) and AI Memory chips for Data Center applications, with the joint development of a cutting-edge AI Memory Platform – purpose-built to address the high-compute, ultra-low latency demands of next-generation AI Servers and Hyperscale Data Centers – as the core project, jointly advancing AI computing infrastructure across Malaysia and Southeast Asia.
Under the MOU, the Parties will leverage their respective engineering capabilities, intellectual properties and technical infrastructure for joint development across five foundational pillars:
1.System Architecture & High-Performance Product Definition
2.Advanced Fabric & Heterogeneous Interconnect Alignment
3.Advanced Packaging, HBM Sub-Systems & Yield Optimization
4.Comprehensive Validation, Silicon Testing & Prototyping
5.Commercial Scaling & Go-To-Market Strategy
With the rapid adoption of generative AI worldwide, next-generation AI servers and hyperscale data centers are driving surging demand for high-throughput, low-latency AI inference acceleration chips and high-performance AI memory solutions such as HBM and CXL. As one of Southeast Asia's most dynamic AI data center markets, Malaysia is attracting significant international investment and industrial activity, with its semiconductor and computing infrastructure sectors entering a phase of rapid growth. The partnership comes at the right time.
Going forward, the two parties will build on this MOU as the blueprint to accelerate the execution of Master Cooperation Agreements and Statements of Work, drive the AI Memory Platform project to fruition, explore further cooperation across more AI computing infrastructure scenarios, and inject new momentum into Southeast Asia's digital economy.
About Linkwing AI Technology (Malaysia)
Linkwing AI Technology (Malaysia) Sdn. Bhd. is the AI-focused subsidiary of Taiwan-based Linkwing Technology established in Malaysia, registered in Senai, Johor, dedicated to serving data center and AI infrastructure needs in Malaysia and Southeast Asia through its localized team.
About XinPal Malaysia
Xinpal (Malaysia) Sdn. Bhd. is XinPal's operating entity in Malaysia, focused on LPU、3D DRAM and IC design solutions covering advanced-process ASIC/SoC design and verification. It is committed to serving Data Center and AI infrastructure customers through localized operations and contributing to Malaysia's semiconductor and AI industry growth.
