In the current era of AI and HPC everything, the built-in repeated computing engine and memory bandwidth is more as possible to enlarge the computing capability. Therefore, the design complexity and chip size are increase more at HPC and AI.
XinPal owns state-of-art solutions ( or capabilities) including multi-level hierarchical design, large scale design verification, service design in software engineering , high-speed IP integration, 2.5D package(CoWoS/InFO) design, and understanding whole system to ensure our customers successfully to enable AI-on-Chip design houses to automate AI accelerator application development, improve system performance, and optimize inference accuracy.
